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No reports of casualties among Chinese nationals received after Colombia’s powerful earthquake: embassy_我的网站

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Rescuers work at a collapsed building after an earthquake in the city of Manizales, Colombia, Aug. 10, 2026. The death toll from a magnitude 7.4 earthquake that struck western Colombia on Monday has risen to 111 nationwide, with 87 others injured, Colombian President Abelardo de la Espriella said in Bogota. (COLPRENSA/Handout via Xinhua)
Following a magnitude 7.4 powerful earthquake that struck Colombia on Monday local time and left hundreds dead and injured, the Chinese Embassy in Colombia said early Tuesday that it has yet to receive reports of casualties among Chinese nationals.
In a post published on its official WeChat public account, the Chinese Embassy in Colombia said it attaches great importance to the safety of Chinese nationals in Colombia and activated its emergency response mechanism immediately to conduct a comprehensive check on the impact of the disaster on Chinese nationals.
So far, no information about Chinese casualties has been received, the embassy said.
According to the Colombian Geological Service, the quake struck at 7:34 am local time in western Colombia. Its epicenter was near San Jose del Palmar, in the department of Choco, at a depth of 96 km, the Xinhua News Agency reported.
The death toll from the earthquake has risen to 111 nationwide, with 87 others injured, Colombian President Abelardo de la Espriella said in Bogota, per Xinhua.
The Chinese Embassy in Colombia also reminded Chinese nationals in Colombia to stay highly vigilant against secondary earthquake hazards including aftershocks and public health risks.
It also advised those encountering emergencies to promptly contact local police and reach out to the embassy for assistance.
The Colombian government earlier Monday declared a state of national disaster to respond to the impact of the earthquake, Xinhua reported.
The quake comes less than two months after twin quakes devastated the north of Venezuela, killing more than 6,300 people, the BBC reported, adding that "it is one of its largest earthquakes in years."
Global Times
。 8月24日消息，据Wccftech报道，SK海力士近日详细阐述了其HBM技术路线图的加速路径，核心举措包括引入EMIB封装方案，并明确将3D集成作为长期目标。 当前，HBM通过TSV（硅通孔）技术将多层DRAM芯片堆叠于基础裸片之上，最高可支持16层堆叠。HBM与计算模块（XPU，涵盖GPU、TPU等）相互独立，通过2.5D封装共同安装于同一中介层。

每个HBM模块配备1024位I/O接口（共16通道），通过物理接口层（PHY）与XPU相连。而下一代HBM4将首次将I/O接口扩展至2048位，这将是自2015年HBM问世以来的最大规格变革。在封装工艺上，目前主要存在两大技术路径：热压键合配合非导电膜（TC+NCF）和整体回流焊配合模塑底部填充（MR+MUF）。前者在应对芯片翘曲方面更具优势，但热阻较高且生产效率偏低；后者生产效率更高、热阻更低，却更易出现翘曲及间隙填充缺陷。

面向未来，SK海力士计划引入混合键合技术，以消除芯片堆叠中的凸块并缩小间距。同时，公司正在开发名为“I-HBM”的局部散热技术（类似三星的HPB方案），旨在优化传热路径，更高效地分散热量，为更高层数的堆叠铺路。 在2.5D封装解决方案方面，SK海力士目前已在传统CoWoS-L、CoWoS-R和CoWoS-S之外，新增了英特尔的EMIB技术，形成更丰富的异构集成选项。 此外，市场传言SK海力士与英特尔有望在存储领域组建合资公司，进一步深化合作。同时，与三星类似，SK海力士也在积极推进3D垂直堆叠方案，将HBM直接置于计算模块之上，以突破现有封装架构的带宽和能效瓶颈。